Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/10/2001
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Application #:
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09494950
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Filing Dt:
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02/01/2000
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Inventors:
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Andrew J. Nagerl, John B. Felice
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Title:
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Method and apparatus for sealing a ball grid array package and circuit card interconnection
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LOCKHEED MARTIN FEDERAL SYSTEMS |
| 1801 STATE ROUTE 17C |
| OWEGO, NEW YORK 13827 |
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| PERKINS, SMITH & COHEN, LLP |
| JERRY COHEN, ESQ. |
| ONE BEACON STREET, 30TH FLOOR |
| BOSTON, MA 02108 |
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Assignment:
2
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CORRECTED RECORDATION TO CORRECT ASSIGNEE'S ADDRESS, PREVIOUSLY RECORDED ON REEL/FRAME 010762/0819
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| 6801 ROCKLEDGE DRIVE |
| BETHESDA, MARYLAND 20817 |
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| PERKINS, SMITH & COHEN, LLP |
| JERRY COHEN, ESQ. |
| ONE BEACON STREET |
| BOSTON, MA 02108 |
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