Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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04/10/2001
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Application #:
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09008801
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Filing Dt:
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01/20/1998
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Inventors:
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MASAYUKI TANAKA, YUMIKO TSURUMI
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Title:
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EPOXY RESIN COMPOSITION TO SEAL SEMICONDUCTORS AND RESIN-SEALED SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, NIHONBASHI-MUROMACHI 2-CHOME CHUO-KU |
| TOKYO 103, JAPAN |
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| MILLER & CHRISTENBURY |
| AUSTIN R. MILLER |
| 1650 MARKET STREET |
| 44TH FLOOR |
| PHILADELPHIA, PA 19103 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 508, HIGASHISHINAGAWA 2, CHOME |
| SHINAGAWA-KU |
| TOKYO 140-0002, JAPAN |
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| PIPER RUDNICK LLP |
| T. DANIEL CHRISTENBURY |
| 1650 MARKET STREET |
| ONE LIBERTY PLACE, STE. 4900 |
| PHILADELPHIA, PA 19103 |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S AD
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| 5-8, HIGASHISHINAGAWA 2-CHOME |
| SHINAGAWA-KU |
| TOKYO 140-0002, JAPAN |
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| PIPER RUDNICK LLP |
| T. DANIEL CHRISTENBURY |
| ONE LIBERTY PLACE, SUITE 4900 |
| 1650 MARKET STREET |
| PHILADELPHIA, PA 19103 |
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