Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/17/2001
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Application #:
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09461469
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Filing Dt:
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12/14/1999
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Inventors:
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QING MA, LISE VARNER, HARRY FUJIMOTO
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Title:
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HEAT SPREADER STRUCTURES FOR ENHANCED HEAT REMOVAL FROM BOTH SIDES OF CHIP-ON-FLEX PACKAGED UNITS
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2625 WALSH AVENUE |
SANTA CLARA, CALIFORNIA 95051 |
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SCHWEGMAN, LUNDBERG, WOESSNER, ET AL |
RUSSELL D. SLIFER |
P.O. BOX 2938 |
MINNEAPOLIS, MINNESOTA 55402 |
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