Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/24/2001
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Application #:
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09040394
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Filing Dt:
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03/18/1998
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Inventors:
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YOSHINOBU MAENO, KENICHIRO ABE, KOUZI SOEKAWA
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Title:
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A PACKAGING STRUCTURE FOR A SEMICONDUCTOR ELEMENT FLIP-CLIP MOUNTED ON A MOUNTING BOARD HAVING STAGGERED BUMP CONNECTION LOCATION ON THE PADS AND METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA 211-8588, JAPAN |
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| ARMSTRONG, WESTERMAN, HATTORI ET AL |
| WILLIAM L. BROOKS |
| SUITE 1000 |
| 1725 K STREET, N.W. |
| WASHINGTON, DC 20006 |
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