Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/08/2001
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Application #:
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09288855
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Filing Dt:
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04/09/1999
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Inventors:
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HIDENORI TAGUCHI, KEISHIRO UMEMURA
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Title:
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CEMENT BONDED WOOD CHIP PRODUCT, RESIN BONDED WOOD CHIP PRODUCT, SIMULATED WOOD PRODUCT AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-5, TAKAIDOHIGASHI 2-CHOME, SUGINAMI-KU |
| TOKYO, JAPAN |
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| OBLON SPIVAK MCCLELLAND MAIER ET AL. |
| C. IRVIN MCCLELLAND |
| 1755 JEFFERSON DAVIS HIGHWAY |
| FOURTH FLOOR |
| ARLINGTON , VA 22202 |
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