Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/15/2001
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Application #:
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09175995
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Filing Dt:
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10/21/1998
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Inventors:
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SHIGEYUKI ONO, TAKASHI OHTA, HIDEYUKI TOKUMITSU, HIRONORI MINAGAWA, OSAMU KOBAYASHI
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Title:
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MOLDING COMPOSITION AND SEALING DEVICE FOR SEALING CARBON DIOXIDE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MINATO-KU |
| 1-12-15, SHIBA-DAIMON |
| TOKYO, JAPAN |
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| JACOBSON, PRICE, HOLMAN & STERN |
| JOHN C. HOLMAN |
| 400 7TH STREET, N.W. |
| WASHINGTON, D.C. 20004 |
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