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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/22/2001
Application #:
09622835
Filing Dt:
08/24/2000
Inventors:
Toshiyuki Shimazawa, Ichiro Takahara
Title:
Heat-expandable microcapsules, process for producing the same, and method of utilizing the same
Assignment: 1
Reel/Frame:
011099/0126Recorded: 08/24/2000Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/08/2000
Exec Dt:
08/08/2000
Assignee:
1-3, SHIBUKAWA-CHO 2-CHOME
YAO-SHI, OSAKA 581-0075, JAPAN
Correspondent:
FOLEY & LARDNER
RICHARD L. SCHWAAB
3000 K STREET, N.W.
SUITE 500
WASHINGTON, DC 20007-5109

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