Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/29/2001
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Application #:
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09185901
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Filing Dt:
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11/04/1998
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Inventors:
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HIROJI AGA, NORIHIRO KOBAYASHI, KIYOSHI MITANI
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Title:
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METHOD FOR HEAT TREATMENT OF SOI WAFER AND SOI WAFER HEAT-TREATED BY THE METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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| LOEB & LOEB LLP |
| WILLIAM H. WRIGHT, ESQ. |
| 10100 SANTA MONICA BLVD. |
| 22ND FLOOR |
| LOS ANGELES, CA 90067-4164 |
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