Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/12/2001
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Application #:
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09305945
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Filing Dt:
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05/06/1999
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Inventors:
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TSUNG-CHIEH CHEN, CHUN-LIANG CHEN, KUANG-HO LIAO
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Title:
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METHOD FOR WIRE BONDING A CHIP TO A SUBSTRATE WITH RECESSED BOND PADS AND DEVICES FORMED
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 123 PARK AVENUE 3RD -SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 30077 |
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| TUNG & ASSOCIATES |
| RANDY W. TUNG |
| 838 WEST LONG LAKE ROAD, SUITE 120 |
| BLOOMFIELD HILLS, MI 48302 |
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