Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/26/2001
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Application #:
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09188565
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Filing Dt:
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11/10/1998
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Inventors:
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MASAHIRO TOMITA, YASUO SOUKI, MOTOKI ITO, KAZUO TANAKA, HIROSHI TANAKA
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Title:
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SEMICONDUCTOR WAFER ETCHING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1 SHOWA-CHO, KARIYA-CITY |
| AICHI-PREF., 448, JAPAN |
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| PILLSBURY MADISON & SUTRO LLP |
| G. LLOYD KNIGHT |
| 1100 NEW YORK AVENUE, N.W. |
| NINTH FLOOR, EAST TOWER |
| WASHINGTON, DC 20005-3918 |
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