Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/26/2001
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Application #:
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09264109
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Filing Dt:
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03/08/1999
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Inventor:
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WEI FENG LIN
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Title:
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METHOD OF ARRANGING THE STAGGERED SHAPE BOND PADS LAYERS FOR EFFECTIVELY REDUCING THE SIZE OF A DIE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 16, CREATION ROAD I |
| HSINCHU, TAIWAN R.O.C |
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| JASON Z. LIN |
| 19597 VIA MONTE DRIVE |
| SARATOGA, CA 95070 |
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