Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/10/2001
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Application #:
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09597908
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Filing Dt:
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06/20/2000
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Inventors:
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Seishi Oida, Yukio Yamaguchi, Yuichiro Yamada, Nobuhiro Suematsu, Takeshi Morikawa
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Title:
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Method for manufacturing resin-molded semiconductor device
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Assignment:
1
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MERGER (SEE DOCUMENT FOR DETAILS).
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1-3-7, SHIROMI, CHUO-KU |
MATSUSHITA IMP BLD., 19TH FLOOR |
OSAKA 540-6319, JAPAN |
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MCDERMOTT, WILL & EMERY |
JAMES E. EAKIN |
2700 SAND HILL ROAD |
MENLO PARK, CA 94025 |
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05/10/2024 05:46 PM
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