Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/21/2001
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Application #:
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09421247
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Filing Dt:
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10/20/1999
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Inventors:
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CHIEN-LI KUO, JUNG-CHAO CHIOU
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Title:
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METHOD OF FORMING A LANDING PAD ON A SEMICONDUCTOR WAFER
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Assignment:
1
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CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNOR, FILED ON 10/20/1999 RECORDED ON REEL 10341 FRAME 0119 ASSIGNOR HEREBY CONFIRMS THE ASSIGNMENT OF THE ENTIRE INTEREST.
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 3, LI-HSIN ROAD 2 |
| HSIN-CHU, TAIWAN R.O.C |
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| WINSTON HSU |
| 3F, NO. 52 LANE 46, MING-SHENG RD. |
| 234 YUNGHO CITY |
| TAIPEI HSIEN, TAIWAN, R.O.C. |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 3, LI-HSIN ROAD 2 |
| HSIN-CHU, TAIWAN R.O.C |
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| WINSTON HSU |
| 3F, NO. 52, LANE 46, MIN-SHENG RD. |
| YUNG-HO CITY, TAIPEI HSIEN |
| TAIWAN, R.O.C. |
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