Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/28/2001
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Application #:
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09483875
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Filing Dt:
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01/18/2000
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Inventor:
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Hsiao Che Wu
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Title:
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Apparatus and method to polish a wafer using abrasive flow
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| 3F, NO. 19, LI HSIN RD., |
| HSINCHU, TAIWAN R.O.C |
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 19, LI HSIN RD. |
| HSINCHU, TAIWAN R.O.C |
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| SCIENCE-BASED INDUSTRIAL PARK |
| WITTELSBACHERPLATZ 2 |
| MUNCHEN, GERMANY D-803 |
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| DARBY & DARBY P.C. |
| YA-CHIAO CHANG, ESQ. |
| 805 THIRD AVENUE, 27TH FLOOR |
| NEW YORK, NY 10022-7513 |
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