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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/04/2001
Application #:
09515849
Filing Dt:
02/29/2000
Inventors:
Toshimitsu Tachibana, Kenji Sato, Mitsuo Iimura
Title:
Method of resin-encapsulating semiconductor chip and mold-releasing film used for the method
Assignment: 1
Reel/Frame:
010657/0377Recorded: 02/09/2000Pages: 2
Conveyance:
INVALID RECORDING, SEE CORRECTIVE RECORDING AT REEL 010804, FRAME 0379 (DOCUMENT RE-RECORDED TO CORRECT RECORDATION DATE).
Assignors:
Exec Dt:
01/26/2000
Exec Dt:
01/26/2000
Exec Dt:
01/26/2000
Assignee:
1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI
OSAKA, JAPAN
Correspondent:
SUGHRUE, MION, ZINN, MACPEAK & SEAS
MARK BOLAND
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, D.C. 20037-3202
Assignment: 2
Reel/Frame:
010884/0379Recorded: 02/29/2000Pages: 5
Conveyance:
(ASSIGNMENT OF ASSIGNOR'S INTEREST) RE-RECORD TO CORRECT THE RECORDATION DATE OF 2/9/00 TO 2/29/00 PREVIOUSLY RECORDED AT REEL 10657 FRAME 0377
Assignors:
Exec Dt:
01/26/2000
Exec Dt:
01/26/2000
Exec Dt:
01/26/2000
Assignee:
1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI
OSAKA, JAPAN
Correspondent:
SUGHRUE, MION ET AL
MARK BOLAND
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, D.C. 20037-3202

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