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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
09/04/2001
Application #:
09483038
Filing Dt:
01/18/2000
Inventors:
Ganesh S. Samudra, Krishnasamy Rajendran, Mei Sheng Zhou, Chi Kwan Lau
Title:
Novel process to achieve uniform groove depth in a silicon substrate
Assignment: 1
Reel/Frame:
010562/0997Recorded: 01/18/2000Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/02/1999
Exec Dt:
09/02/1999
Exec Dt:
09/02/1999
Exec Dt:
09/02/1999
Assignee:
60 WOODLANDS INDUSTRIAL PARK D, STREET 2
SINGAPORE, SINGAPORE 73840
Correspondent:
GEORGE O. SAILE
20 MCINTOSH DRIVE
POUGHKEEPSIE, NY 12603
Assignment: 2
Reel/Frame:
049490/0001Recorded: 11/29/2018Pages: 892
Conveyance:
SECURITY AGREEMENT
Assignor:
Exec Dt:
11/27/2018
Assignee:
1100 NORTH MARKET STREET
WILMINGTON, DELAWARE 19801
Correspondent:
CT CORPORATION
4400 EASTON COMMONS WAY
SUITE 125
COLUMBUS, OH 43219
Assignment: 3
Reel/Frame:
054636/0001Recorded: 11/20/2020Pages: 911
Conveyance:
RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/17/2020
Assignee:
PO BOX 309, UGLAND HOUSE
MAPLES CORPORATE SERVICES LIMITED
GRAND CAYMAN, CAYMAN ISLANDS KY1-1104
Correspondent:
BENJAMIN PETERSEN
1460 EL CAMINO REAL, 2ND FLOOR
SHEARMAN & STERLING LLP
MENLO PARK, CA 94025

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