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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/04/2001
Application #:
09348276
Filing Dt:
07/07/1999
Inventors:
TADAHIRO KATO, SADAYUKI OKUNI, KEIICHI OKABE, HISASHI OSHIMA
Title:
MANUFACTURING PROCESS FOR SEMICONDUCTOR WAFER
Assignment: 1
Reel/Frame:
010089/0139Recorded: 07/07/1999Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/09/1999
Exec Dt:
06/09/1999
Exec Dt:
06/14/1999
Exec Dt:
06/09/1999
Assignee:
TOGINBIRU, 4-2, MARUNOUCHI 1-CHOME, CHIYODA-KU
TOKYO, JAPAN
Correspondent:
EVERSON, MCKEOWN, EDWARDS, ETAL
J. D. EVANS
1200 G STREET,N.W. SUITE 700
WASHINGTON, D.C. 20005

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