Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
2
|
Patent #:
|
|
Issue Dt:
|
09/11/2001
|
Application #:
|
09457960
|
Filing Dt:
|
12/09/1999
|
Inventors:
|
Leon Ashley, Hormazdyar M. Dalal, Du Binh Nguyen, Hazara S. Rathore, Richard G. Smith
|
Title:
|
Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
2070 ROUTE 52 |
HOPEWELL JUNCTION, NEW YORK 12533 |
|
|
|
HESLIN ROTHENBERG FARLEY & MESITI P.C. |
5 COLUMBIA CIRCLE |
ALBANY, NY 12203 |
|
|
Assignment:
2
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
PO BOX 309 |
UGLAND HOUSE |
GRAND CAYMAN, CAYMAN ISLANDS KY1-1104 |
|
|
|
HESLIN ROTHENBERG FARLEY & MESITI P.C. |
5 COLUMBIA CIRCLE |
ALBANY, NY 12203 |
|
|
Search Results as of:
05/08/2024 12:54 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|