Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/18/2001
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Application #:
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09652642
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Filing Dt:
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08/31/2000
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Inventors:
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Hitoshi Kurabe, Mitsuhito Shibata, Masakazu Mitsuhashi
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Title:
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Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11 1, OSAKI 1-CHOME, SHINAGAWA-KU |
| TOKYO 141-8584, JAPAN |
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| WEBB ZIESENHEIM LOGSDON ET AL |
| KENT E. BALDAUF |
| 700 KOPPERS BUILDING |
| 436 SEVENTH AVENUE |
| PITTSBURGH, PA 15219-1818 |
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