Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/18/2001
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Application #:
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09341918
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Filing Dt:
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07/21/1999
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Inventors:
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SEISHI OIDA, YUKIO YAMAGUCHI, NOBUHIRO SUEMATSU
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Title:
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RESIN-MOLDED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SAIWAI-CHO, TAKATSUKI-SHI |
| OSAKA 561-1193, JAPAN |
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| SIXBEY, FRIEDMAN, LEEDOM & FERGUSON, PC |
| ERIC J. ROBINSON |
| 8180 GREENSBORO DRIVE, SUITE 800 |
| MCLEAN, VA 22102 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1006, OAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN 571-8 |
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| NIXON PEABODY LLP |
| ERIC J. ROBINSON |
| 8180 GREENSBORO DRIVE, SUITE 800 |
| MCLEAN, VIRGINIA 22102 |
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