Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/25/2001
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Application #:
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09522328
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Filing Dt:
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03/09/2000
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Inventor:
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Rajeev Joshi
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Title:
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High performance flip chip package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5005 E. MCDOWELL ROAD, MD A700 |
PHOENIX, ARIZONA 85008 |
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
5005 E. MCDOWELL ROAD |
MD A700 |
PHOENIX, AZ 85008 |
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