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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
10/02/2001
Application #:
08234073
Filing Dt:
04/28/1994
Inventors:
MASAZUMI AMAGAI, KAZUYOSHI EBE, HIDEO SENOO
Title:
PROCESS FOR PREPARING A SEMICONDUCTOR WAFER
Assignment: 1
Reel/Frame:
007050/0914Recorded: 07/01/1994Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/22/1994
Exec Dt:
06/22/1994
Assignee:
23-23-HONCHO, ITABASHI-KU
TOKYO, JAPAN
Correspondent:
WILLIAM E. HILLER
TEXAS INSTRUMENTS INCORPORATED
P.O. BOX 655474, M/S 219
DALLAS, TEXAS 75265
Assignment: 2
Reel/Frame:
007050/0917Recorded: 07/01/1994Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/24/1994
Exec Dt:
06/22/1994
Assignee:
13510 NORTH CENTRAL EXPRESSWAY
DALLAS, TEXAS 75243
Correspondent:
WILLIAM E. HILLER
TEXAS INSTRUMENTS INCORPORATED
P.O. BOX 655474, M/S 219
DALLAS, TEXAS 75265

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