Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/09/2001
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Application #:
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09158299
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Filing Dt:
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09/22/1998
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Inventors:
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KOICHI HIRANO, SEIICHI NAKATANI
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Title:
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SEMICONDUCTOR CHIP BONDED TO A THERMAL CONDUCTIVE SHEET HAVING THROUGH HOLE FOR ELECTRICAL CONNECTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1006-BANCHI, OAZA-KADOMA |
| KADOMA-SHI, OSAKA 571-8501, JAPAN |
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| MERCHANT GOULD, SMITH, ET AL. |
| DOUGLAS P. MUELLER |
| 3100 NORWEST CENTER |
| 90 SOUTH SEVENTH STREET |
| MINNEAPOLIS, MN 55402-4131 |
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