Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/09/2001
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Application #:
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08872950
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Filing Dt:
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06/11/1997
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Inventors:
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OSAMU ISHIKAWA, MASAHIRO MAEDA
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Title:
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RADIO FREQUENCY MODULE WITH THERMALLY AND ELECTRICALLY COUPLED METAL FILM ON INSULATING SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| KADOMA-SHI |
| 1006, OAZA KADOMA |
| OSAKA, JAPAN 571 |
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| RENNER, OTTO, BOISSELLE ET AL. |
| NEIL A. DUCHEZ |
| 1621 EUCLID AVENUE |
| NINETEENTH FLOOR |
| CLEVELAND, OH 44115-2191 |
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