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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/23/2001
Application #:
09394798
Filing Dt:
09/10/1999
Inventors:
TETSUYA YAMAMOTO, SHIGEKI KAWAMURA, SANAE TANIGUCHI
Title:
SEMICONDUCTOR PACKAGING METAL LID
Assignment: 1
Reel/Frame:
010434/0746Recorded: 12/02/1999Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/30/1999
Exec Dt:
09/30/1999
Exec Dt:
09/30/1999
Assignees:
2701-1, AZA-IWAKURA, HIGASHIBUN, OMINE-CHO
MINE-SHI, YAMAGUCHI, JAPAN
23 SENJU-HASHIDO-CHO, ADACHI-KU
TOKYO, JAPAN
Correspondent:
WEBB ZIESENHEIM LOGSDON ORKIN ET AL
JOHN W. MCILVAINE
700 KOPPERS BUILDING
436 SEVENTH AVENUE
PITTSBURGH, PENNSYLVANIA 15219-1818

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