Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/30/2001
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Application #:
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09385756
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Filing Dt:
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08/30/1999
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Inventors:
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NOBUKAZU ITO, YOSHIHISA MATSUBARA
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Title:
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METHOD OF FORMING MULTI-LEVEL COPPER INTERCONNECT WITH FORMATION OF COPPER OXIDE ON EXPOSED COPPER SURFACE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1 SHIBA 5-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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| FOLEY, HOAG & ELIOT LLP |
| DONALD W. MUIRHEAD |
| ONE POST OFFICE SQUARE |
| BOSTON, MA 02109-2170 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI, KANAGAWA 211-8668, JAPAN |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| WASHINGTON, DC 20037 |
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