Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/06/2001
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Application #:
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09350143
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Filing Dt:
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07/09/1999
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Inventors:
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ISAO YOKOKAWA, KIYOSHI MITANI
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Title:
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METHOD FOR MANUFACTURING BONDED WAFER AND BONDED WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-2, MARUNOUCHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| GREENBLUM & BERNSTEIN, P.L.C. |
| BRUCE H. BERNSTEIN |
| 1941 ROLAND CLARKE PLACE |
| RESTON, VIRGINIA 20191 |
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