Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/06/2001
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Application #:
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09370732
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Filing Dt:
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08/09/1999
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Inventor:
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EDMUND D. BLACKSHEAR
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Title:
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PRE-BOND ENCAPSULATION OF AREA ARRAY TERMINATED CHIP AND WAFER SCALE PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| IBM CORPORATION |
| JAY H. ANDERSON, ESQ. |
| EAST FISHKILL FACILITY, 1580 ROUTE 52 |
| DEPT. 18G/ BLDG. 300-482 |
| HOPEWELL JUNCTION, NY 12533-6531 |
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