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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/13/2001
Application #:
09666662
Filing Dt:
09/20/2000
Inventors:
Naoto Hiramatsu, Sadayuki Nakamura, Kazuyuki Kageoka
Title:
Stainless steel sheet having Cu-enriched grains dispersed in its matrix and/or a Cu-condensed layer
Assignment: 1
Reel/Frame:
011319/0474Recorded: 11/20/2000Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/11/2000
Exec Dt:
09/11/2000
Exec Dt:
09/11/2000
Assignee:
4-1, MARUNOUCHI 3-CHOME, CHIYODA-KU
TOKYO 100-8366, JAPAN
Correspondent:
WEBB ZIESENHEIM LOGSDON ORKIN ET AL.
RUSSELL D. ORKIN
700 KOPPERS BUILDING
436 SEVENTH AVENUE
PITTSBURGH, PENNSYLVANIA 15219-1818

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