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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
11/13/2001
Application #:
09201170
Filing Dt:
11/30/1998
Inventors:
YU-HWA LO, JIZHI ZHANG
Title:
METHOD FOR JOINING WAFERS AT A LOW TEMPERATURE AND LOW STRESS
Assignment: 1
Reel/Frame:
009631/0196Recorded: 11/30/1998Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/06/1998
Exec Dt:
11/07/1998
Assignee:
SUITE 201
95 BROWN ROAD
ITHACA, NEW YORK 14850
Correspondent:
BROWN, PINNISI AND MICHAELS, PC
CHRISTOPHER R. PASTEL
400 M&T BANK BUILDING
118 NORTH TIOGA STREET
ITHACA, NEW YORK 14850
Assignment: 2
Reel/Frame:
018268/0607Recorded: 09/19/2006Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/05/2006
Assignee:
1220 PAGE AVENUE
FREMONT, CALIFORNIA 94538
Correspondent:
WARREN S. WOLFELD
751 KELLY STREET
HAYNES BEFFEL & WOLFELD
HALF MOON BAY, CA 94019
Assignment: 3
Reel/Frame:
022846/0854Recorded: 06/10/2009Pages: 10
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/17/2009
Assignee:
LEE CONNER
406 BLACKWELL STREET, SUITE 240
DURHAM, NORTH CAROLINA 27701
Correspondent:
LEE CONNER
405 BLACKWELL STREET
SUITE 240
SQUARE 1 BANK
DURHAM, NC 27701

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