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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/20/2001
Application #:
09076219
Filing Dt:
05/08/1998
Inventor:
NGUYEN D. BUI
Title:
INTERCONNECTION DEVICE FOR LOW AND HIGH CURRENT STRESS ELECTROMIGRATION AND CORRELATION STUDY
Assignment: 1
Reel/Frame:
009183/0723Recorded: 05/08/1998Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/29/1998
Assignee:
ONE AMD PLACE
SUNNYVALE, CALIFORNIA 94088
Correspondent:
DAVIS CHIN
LAW OFFICES OF DAVIS CHIN
209 SOUTH LASALLE STREET, SUITE 410
CHICAGO, IL 60604

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