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Patent Assignment Abstract of Title
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Total Assignments: 4
Patent #:
Issue Dt:
12/04/2001
Application #:
09519908
Filing Dt:
03/07/2000
Inventors:
Victor Liang, Olivier Laparra, Mark Rubin
Title:
Trench-diffusion corner rounding in a shallow-trench (sti) process
Assignment: 1
Reel/Frame:
010632/0668Recorded: 03/07/2000Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/28/2000
Exec Dt:
01/28/2000
Assignee:
LEGAL DEPARTMENT, MS/45
1109 MCKAY DRIVE
SAN JOSE, CALIFORNIA 95131
Correspondent:
DOUGLAS L. WELLER
431 MAGNOLIA LANE
SANTA CLARA, CA 95051
Assignment: 2
Reel/Frame:
018654/0521Recorded: 12/20/2006Pages: 13
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/13/2006
Assignee:
HIGH TECH CAMPUS 60
5656 AG EINDHOVEN, NETHERLANDS
Correspondent:
ELIZABETH PARSONS
1825 EYE STREET, NW
WASHINGTON, DC 20006
Assignment: 3
Reel/Frame:
039610/0734Recorded: 08/08/2016Pages: 16
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/01/2016
Assignee:
HIGH TECH CAMPUS 60
EINDHOVEN, NETHERLANDS 5656 AG
Correspondent:
NXP SEMICONDUCTORS
411 EAST PLUMERIA DRIVE, MS41
SAN JOSE, CA 95134
Assignment: 4
Reel/Frame:
048328/0964Recorded: 02/13/2019Pages: 16
Conveyance:
RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/11/2019
Assignee:
HIGH TECH CAMPUS 60
EINDHOVEN, NETHERLANDS NL-5656 AG
Correspondent:
INTELLECTUAL PROPERTY AND LICENSING NXP
6501 WILLIAM CANNON DRIVE WEST TX30/OE62
AUSTIN, TX 95134

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