Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/11/2001
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Application #:
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09448072
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Filing Dt:
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11/23/1999
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Inventors:
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TODD O. BOLKEN, CARY J. BAERLOCHER, DAVID J. CORISIS, CHAD A. COBBLEY
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Title:
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PACKAGES FOR SEMICONDUCTOR DIE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83706 |
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| KLARQUIST SPARKMAN CAMPBELL ET AL. |
| MICHAEL D. JONES |
| 121 S.W. SALMON STREET |
| ONE WORLD TRADE CENTER, SUITE 1600 |
| PORTLAND, OR 97204-2988 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26 DEER CREEK LANE |
| MT. KISCO, NEW YORK 10549 |
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| CHRISTOPHER C. HENRY |
| ROPES & GRAY LLP |
| 1211 AVENUE OF THE AMERICAS |
| NEW YORK, NEW YORK 10036 |
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