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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/18/2001
Application #:
08673623
Filing Dt:
06/26/1996
Inventors:
JEFFREY HONEYCUTT, SUJIT SHARAN
Title:
METHOD OF VLSI CONTACT, TRENCH, AND VIA FILLING USING A GERMANIUM UNDERLAYER WITH LOW TEMPERATURE METALLIZATION
Assignment: 1
Reel/Frame:
008160/0994Recorded: 06/26/1996Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/21/1996
Exec Dt:
06/21/1996
Assignee:
8000 SOUTH FEDERAL WAY
BOISE, IDAHO 83707
Correspondent:
BRADLEY K. DESANDRO
60 EAST SOUTH TEMPLE
1000 EAGLE GATE TOWER
SALT LAKE CITY, UT 84111
Assignment: 2
Reel/Frame:
008433/0161Recorded: 01/07/1997Pages: 4
Conveyance:
TO CHANGE STATE OF INCORPORATION OF ASSIGNEE FROM IDAHO TO DELAWARE
Assignors:
Exec Dt:
06/21/1996
Exec Dt:
06/21/1996
Assignee:
8000 SOUTH FEDERAL WAY
BOISE, IDAHO 83707
Correspondent:
WORKMAN, NYDEGGER & SEELEY
BRADLEY K. DESANDRO
1000 EAGLE GATE TOWER
60 EAST SOUTH TEMPLE
SALT LAKE CITY, UT 84111

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