Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/25/2001
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Application #:
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09383577
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Filing Dt:
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08/25/1999
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Inventors:
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TAKESHI SATO, HIROMI TOKUNAGA, KENICHI SAKAGUCHI
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Title:
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PROCESS FOR MANUFACTURING A PREMOLD TYPE SEMICONDUCTOR PACKAGE USING SUPPORT PINS IN THE MOLD AND EXTERNAL CONNECTOR BUMPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 711, AZA SHARIDEN, OAZA KURITA, NAGANO-SHI |
| NAGANO 380-0921, JAPAN |
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| PENNIE & EDMONDS LLP |
| ALLAN A. FANUCCI |
| 1155 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10036 |
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