Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/01/2002
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Application #:
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09710906
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Filing Dt:
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11/14/2000
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Inventor:
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Kenji Koya
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Title:
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Multilayer printed wiring board provided with injection hole for thermally conductive filler
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, SHIBA 5-CHOME MINATO-KU |
| TOKYO, JAPAN |
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| FOLEY & LARDNER |
| DAVID A. BLUMENTHAL |
| 3000 K ST, N.W., SUITE 500 |
| WASHINGTON, DC 20007-5109 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-1, KITAMIKATA 2-CHOME, TAKATSU-KU, KAWASAKI |
| TOKYO, JAPAN |
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| HOWARD L. BERNSTEIN |
| 2100 PENNSYLVANIA AVE, NW |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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