Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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01/08/2002
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Application #:
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09629481
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Filing Dt:
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06/19/2000
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Inventors:
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Tatsumi Tuchiya, Tatsushi Yoshida, Yasuhiro Mita, Tadaaki Tomiyama, Takao Kidachi et al
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Title:
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Solder ball connection device and capillary tube thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| FELSMAN, BRADLEY, VADEN, GUNTER, ET AL. |
| ANDREW J. DILLON, ESQ. |
| SUITE 350, LAKEWOOD ON THE PARK |
| 7600B NORTH CAPITAL OF TEXAS HWY. |
| AUSTIN, TEXAS 78731 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| JOHAN HUIZINGALAAN 765 |
| AMSTERDAM, NETHERLANDS 1066VH |
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| ROBERT E. SCHEID |
| MORRISON & FOERSTER LLP |
| 425 MARKET STREET |
| SAN FRANCISCO, CALIFORNIA 94105-2482 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| LOCATELLIKADE 1 |
| PARNASSUSTOREN |
| 1076 AZ AMSTERDAM, NETHERLANDS |
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| MORRISON & FOERSTER LLP |
| ROBERT E. SCHEID |
| 425 MARKET STREET |
| SAN FRANCISCO, CA 94105-2482 |
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