Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/15/2002
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Application #:
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09489462
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Filing Dt:
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01/21/2000
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Inventors:
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Chieh-Chuan Huang, Cheng-Yu Chu, Shun-Liang Hsu
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Title:
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Method for forming optoelectronic microelectronic fabrication with attenuated bond pad corrosion
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SCIENCE-BASED INDUSTRIAL PARK |
NO. 121 PARK AVENUE 3 |
HSIN-CHU, TAIWAN R.O.C |
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TUNG & ASSOCIATES |
RANDY W. TUNG |
838 W. LONG LAKE ROAD |
SUITE 210 |
BLOOMFIELD HILLS, MI 48302 |
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