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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/05/2002
Application #:
09581814
Filing Dt:
09/08/2000
Inventors:
Masato Yoshida, Toranosuke Ashizawa, Hiroki Terazaki, Kiyohito Tanno, Yuuto Ootuki et al
Title:
Abrasive, method of polishing wafer, and method of producing semiconductor device
Assignment: 1
Reel/Frame:
011094/0768Recorded: 09/08/2000Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/23/2000
Exec Dt:
06/26/2000
Exec Dt:
06/23/2000
Exec Dt:
06/26/2000
Exec Dt:
06/23/2000
Exec Dt:
06/26/2000
Exec Dt:
06/26/2000
Assignee:
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU
TOKYO, JAPAN
Correspondent:
ANTONELLI, TERRY, STOUT & KRAUS, LLP
WILLIAM I. SOLOMON
1300 NORTH SEVENTEENTH STREET
SUITE 1800
ARLINGTON, VA 22209

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