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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/19/2002
Application #:
09805955
Filing Dt:
03/15/2001
Inventors:
Subhash Gupta, Yi Xu, Simon Chooi, Mei Sheng Zhou
Title:
Method to improve adhesion of organic dielectrics in dual damascene interconnects
Assignment: 1
Reel/Frame:
011653/0181Recorded: 03/15/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/03/2001
Exec Dt:
01/03/2001
Exec Dt:
01/03/2001
Exec Dt:
01/03/2001
Assignee:
1450 MCCANDLESS DRIVE
MILPITAS, CALIFORNIA 95035
Correspondent:
GEORGE O. SAILE
20 MCINTOSH DRIVE
POUGHKEEPSIE, NY 12603
Assignment: 2
Reel/Frame:
013467/0683Recorded: 11/07/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/19/2002
Assignee:
60 WOODLANDS INDUSTRIAL PARK D
STREET 2
SINGAPORE, SINGAPORE 738406
Correspondent:
GEORGE O. SAILE
28 DAVIS AVENUE
POUGHKEEPSIE, NY 12603

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