Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/26/2002
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Application #:
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09633438
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Filing Dt:
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08/07/2000
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Inventors:
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Noboru Shingai, Tatsuo Wada, Katsuro Aoshima
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Title:
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Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 5668-1, FUKUDA, YAMATO-SHI |
| KANAGAWA, JAPAN |
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| FRISHAUF, HOLTZ, GOODMAN & CHICK, P.C. |
| LEONARD HOLTZ |
| 767 THIRD AVENUE, 25TH FLOOR |
| NEW YORK, NY 10017-2023 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 14-15, OGAMI 5-CHOME, |
| AYASE-SHI, KANAGAWA, JAPAN |
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| LEONARD HOLTZ |
| 220 FIFTH AVENUE |
| 16TH FLOOR |
| NEW YORK, NY 10001-7708 |
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