Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/05/2002
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Application #:
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09532443
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Filing Dt:
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03/23/2000
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Inventors:
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Fumio Ohashi, Takashi Hori, Michio Iguchi, Hiroshi Akutsu, Takashi Narita et al
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Title:
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Solder ball container
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23, SENJU-HASHIDO-CHO |
| ADACHI-KU, TOKYO, JAPAN |
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| MICHAEL TOBIAS |
| SUITE 200 |
| 2000 P STREET N.W. |
| WASHINGTON, D.C. 20036 |
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