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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/05/2002
Application #:
09524421
Filing Dt:
03/11/2000
Inventor:
Wen-Kun Yang
Title:
Method and apparatus for wafer level burn-in
Assignment: 1
Reel/Frame:
015271/0045Recorded: 04/28/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/20/2004
Assignee:
NO. 65, KUANG-FU NORTH RD.
HSINCHU INDUSTRIAL PARK, HU-KOU
HSINCHU COUNTY, TAIWAN
Correspondent:
SUPREME PATENT SERVICES
JASON Z. LIN
PO BOX 2339
SARATOGA, CA 95070

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