Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/05/2002
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Application #:
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09491117
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Filing Dt:
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01/24/2000
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Inventors:
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Stefan Grotsch, Hans-Ludwidg Althaus, Werner Spath, Georg Bogner
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Title:
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Apparatus and method for producing a chip-substrate connection
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ST. MARTIN STRASSE 53 |
| D-81669 MUNCHEN, GERMANY |
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| LERNER AND GREENBERG |
| DENISE LETTAU |
| PO BOX 2480 |
| HOLLYWOOD, FL 33022 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LANE 121, LI-DER RD., PEITO DISTRICT |
| 3RD FL., NO. 12 |
| TAIPEI, TAIWAN |
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| SAMIR A. BHAVSAR |
| 2001 ROSS AVENUE |
| SUITE 600 |
| DALLAS, TX 75201-2980 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SAMIR A. BHAVSAR, ESQ.. |
| BAKER BOTTS L.L.P. |
| 2001 ROSS AVENUE, SUITE 600 |
| DALLAS, TEXAS 75201-2980 |
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