Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/12/2002
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Application #:
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09706321
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Filing Dt:
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11/03/2000
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Inventors:
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Bo Zheng, Ling Chen, Alfred Mak, Mei Chang
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Title:
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Deposition of copper with increased adhesion
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| APPLIED MATERIALS, INC. |
| RAYMOND R. MOSER, JR. |
| 3050 BOWERS AVENUE |
| P.O. BOX 450A |
| SANTA CLARA, CA 95052 |
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