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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/26/2002
Application #:
09839371
Filing Dt:
04/23/2001
Inventors:
Masayuki Kitajima, Hitoshi Homma, Masakazu Takesue, Yutaka Noda, Tadaaki Shono
Title:
SOLDER ALLOY AND SOLDERED BOND
Assignment: 1
Reel/Frame:
011729/0732Recorded: 04/23/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/10/2001
Exec Dt:
04/10/2001
Exec Dt:
04/10/2001
Exec Dt:
04/10/2001
Exec Dt:
04/10/2001
Assignee:
NAKAHARA-KU, KAWASAKI-SHI
1-1, KAMIKODANAKA 4-CHOME
KANAGAWA 211-8588, JAPAN
Correspondent:
ARMSTRON, WESTERMAN, HATTORI ET AL
STEPHEN G. ADRIAN
1725 K STREET, N.W., SUITE 1000
WASHINGTON, D.C. 20006

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