Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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04/02/2002
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Application #:
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09194735
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Filing Dt:
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12/02/1998
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Inventors:
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YOSHIHIRO ISHIDA, KIYOSHI SHIMIZU, TETSUO SATO, SHINICHI NISHIKATA, SHUICHI ISHIWATA et al
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Title:
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PROCESS FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1 NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU |
| TOKYO 163-0428, JAPAN |
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| KANESAKA & TAKEUCHI |
| MANABU KANESAKA |
| 1423 POWHATAN STREET |
| ALEXANDRIA, VIRGINIA 22314 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1-12, TANASHICHO 6-CHOME, NISHITOKYO-SHI |
| TOKYO, JAPAN 188-8511 |
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| DAVID J. CUSHING - SUGHRUE MION PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, D.C, DC 20037 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1-12, TANASHICHO 6-CHOME, NISHITOKYO-SHI, |
| TOKYO, JAPAN 188-8511 |
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| CPA GLOBAL LTD |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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