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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
04/16/2002
Application #:
09513483
Filing Dt:
02/25/2000
Inventors:
Richard F. Hill, Forest Hampton III
Title:
Multi-Layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
Assignment: 1
Reel/Frame:
010652/0525Recorded: 02/25/2000Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/24/2000
Exec Dt:
02/24/2000
Assignee:
3256 WEST 25TH STREET
CLEVELAND, OHIO 44109
Correspondent:
WYATT, GERBER, MELLER AND O'ROURKE
EUGENE LIEBERSTEIN
P.O. BOX 2198
GRAND CENTRAL STATION
NEW YORK, NY 10163
Assignment: 2
Reel/Frame:
041803/0831Recorded: 03/31/2017Pages: 5
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/31/2016
Assignee:
3481 RIDER TRAIL SOUTH
EARTH CITY, MISSOURI 63045
Correspondent:
HUSCH BLACKWELL LLP
190 CARONDELET PLAZA
SUITE 600
ST. LOUIS, MO 63105

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