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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
6373717
Issue Dt:
04/16/2002
Application #:
09540172
Filing Dt:
03/31/2000
Inventors:
Francis J Downes JR., Donald S Farquhar, Elizabeth Foster, Robert M Japp et al
Title:
ELECTRONIC PACKAGE WITH HIGH DENSITY INTERCONNECT LAYER
Assignment: 1
Reel/Frame:
010967/0243Recorded: 07/03/2000Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
DOWNES, FRANCIS J., JR.
Exec Dt:
05/03/2000
FOSTER, ELIZABETH
Exec Dt:
05/08/2000
JONES, GERALD W.
Exec Dt:
05/04/2000
SEBESTA, ROBERT D.
Exec Dt:
05/01/2000
FARQUHAR, DONALD S.
Exec Dt:
05/05/2000
JAPP, ROBERT M.
Exec Dt:
05/05/2000
KRESGE, JOHN S.
Exec Dt:
05/03/2000
STONE, DAVID B.
Exec Dt:
05/03/2000
WILCOX, JAMES R.
Exec Dt:
05/18/2000
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
SCHMEISER, OLSEN & WATTS
JACK P. FRIEDMAN
3 LEAR JET LANE
SUITE 201
LATHAM, NY 12110
Assignment: 2
Reel/Frame:
031039/0015Recorded: 08/19/2013Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
INTERNATIONAL BUSINESS MACHINES
Exec Dt:
08/05/2013
Assignee:
ULTRATECH, INC.
3050 ZANKER ROAD
SAN JOSE, CALIFORNIA 95134
Correspondent:
ALLSTON L. JONES
425 SHERMAN AVENUE, SUITE 230
PALO ALTO, CA 94306

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