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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
6376591
Issue Dt:
04/23/2002
Application #:
09452511
Filing Dt:
12/01/1999
Inventors:
TIE LAN, VASILIKI PSIHOGIOS, SAM RICHARD TURNER, GARY WAYNE CONNELL et al
Title:
HIGH BARRIER AMORPHOUS POLYAMIDE-CLAY INTERCALATES, EXFOLIATES, AND NANOCOMPOSITES AND A PROCESS FOR PREPARING SAME
Assignment: 1
Reel/Frame:
010659/0243Recorded: 03/07/2000Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LAN, TIE
Exec Dt:
02/10/2000
PSIHOGIOS, VASILIKI
Exec Dt:
02/10/2000
TURNER, SAM R.
Exec Dt:
02/15/2000
CONNELL, GARY W.
Exec Dt:
02/15/2000
MATAYABAS, JAMES C., JR.
Exec Dt:
02/23/2000
GILMER, JOHN W.
Exec Dt:
02/15/2000
Assignee:
AMCOL INTERNATIONAL CORPORATION
150 WEST SHURE DRIVE
ONE NORTH ARLINGTON
ARLINGTON HEIGHTS, ILLINOIS 60004
Correspondent:
MARSHALL, O'TOOLE, GERSTEIN ET AL.
RICHARD H. ANDERSON
6300 SEARS TOWER
233 SOUTH WACKER DRIVE
CHICAGO, IL 60606-6402
Assignment: 2
Reel/Frame:
032918/0776Recorded: 05/15/2014Pages: 22
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
AMCOL INTERNATIONAL CORPORATION
Exec Dt:
05/09/2014
Assignee:
JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
10 S. DEARBORN
7TH FLOOR
CHICAGO, ILLINOIS 60603
Correspondent:
ANJALI KULKARNI
2475 HANOVER STREET
PALO ALTO, CA 94304

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